发明名称 |
Semiconductor device and method of manufacturing the same |
摘要 |
A semiconductor device manufacturing method is disclosed. A semiconductor substrate having a separation region and a semiconductor region which covers the separation region entirely is prepared. One or a plurality of circuit elements are formed in the semiconductor region. The semiconductor substrate is split at the separation region.
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申请公布号 |
US2006049487(A1) |
申请公布日期 |
2006.03.09 |
申请号 |
US20050222895 |
申请日期 |
2005.09.08 |
申请人 |
SATO NOBUHIKO;KIDO SHIGERU;MOMOI KAZUTAKA |
发明人 |
SATO NOBUHIKO;KIDO SHIGERU;MOMOI KAZUTAKA |
分类号 |
H01L21/78 |
主分类号 |
H01L21/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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