| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an absorption nozzle for an electronic component capable of stably taking out a micro component from a carrier tape, and to provide an electronic component mounting device provided with the absorption nozzle. <P>SOLUTION: The absorption nozzle 15 for the electronic component is fixed to the mounting head of the electronic component mounting device and takes out the electronic component P2 housed in the rectangular cavity 14a of the carrier tape 14. Each corner of the absorption plane 15b provided at the lower end part of the rectangular-cross-section nozzle 15a which press contacts the electronic component is cut by a corner-taper-cut plane 17c, and an aerating part for communicating an inside and the outside of the rectangular cavity 14a with the absorption plane 15b press contacted to the upper face of the carrier tape 14 is provided. This prevents an occurrence of trouble that the carrier tape 14 itself is absorbed by the negative pressure of the whole inside of the rectangular cavity 14a at the time of absorption to stably take out the electronic component P2 from the carrier tape 14. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
