发明名称 FLEXIBLE WIRING CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a flexible wiring circuit board wherein a connection terminal can be passed through a connection terminal to be joined to the first-mentioned terminal part and can be always reliably contacted therewith and wherein disconnection or short-circuiting in wiring can less occur with an excellent reliability, also to provide a method for manufacturing the flexible wiring circuit board. SOLUTION: A wiring layer 17 obtained by patterning a conductor layer having a uniform film thickness such as a copper foil into a predetermined wiring pattern is bonded on one main surface of a base film 16 with an adhesive layer 18 disposed therebetween. The wiring 17b of the wiring layer 17 other than connection terminals 17a at its both ends is formed to be thinner by a predetermined thicknessΔt. A protective film layer 19 made of a humidity resistance insulating material such as a PET resin film is bonded with an adhesive layer 20 to the wiring 17b of each wiring layer 17, so that the height of the surface of the protective film layer 19 coincides with that of the connection terminal 17a. As a result, a flexible wiring circuit board 15 can be obtained with a flat main surface to be joined having no step difference. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006066759(A) 申请公布日期 2006.03.09
申请号 JP20040249536 申请日期 2004.08.30
申请人 CASIO COMPUT CO LTD 发明人 OHASHI TAKAFUMI
分类号 H05K1/11;H05K1/02;H05K3/06;H05K3/18;H05K3/28 主分类号 H05K1/11
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