发明名称 WIRING PATTERN, ITS FORMATION METHOD, ELECTRO-OPTICAL DEVICE, AND ELECTRONIC MACHINE
摘要 PROBLEM TO BE SOLVED: To shorten process time in forming a wiring pattern. SOLUTION: A wiring pattern forming method for forming a wiring pattern on a liquid-repellent substrate P includes a step of forming a lyophilic region H1 by discharging and locating a lyophilic material X2 by means of a drip discharging method, and a step of providing a functional liquid containing conductive particles on the lyophilic region to form the wiring pattern by drying and baking. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006066675(A) 申请公布日期 2006.03.09
申请号 JP20040247914 申请日期 2004.08.27
申请人 SEIKO EPSON CORP 发明人 TOYODA NAOYUKI;TAKIGUCHI HIROSHI
分类号 H01L21/3205;G02F1/1343;G02F1/1345;G09F9/00;G09F9/30;H01L21/288;H01L21/336;H01L29/417;H01L29/423;H01L29/49;H01L29/786;H01L51/50;H05B33/10 主分类号 H01L21/3205
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