| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic part device capable of suppressing connection failure between an external component and a connection terminal. SOLUTION: The nozzle diameter of a second nozzle 10b which discharges resin near the border of a coating region D on a substrate is set smaller than that of a first nozzle 10a which discharges the resin other than in the vicinity of border of the coating region D. So, the amount of resin discharged near the border of the coating region D on the substrate is smaller than that discharged other than in the vicinity of border of the coating region D on the substrate. As a result, a sagging resin is suppressed from sticking to a connection terminal arranged close to the border of the coating region D on the substrate 5, to suppress failure such as defective connection to the external part. COPYRIGHT: (C)2006,JPO&NCIPI
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