| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board that can effectively prevent the occurrence of mechanical destruction in joint surfaces between connection pads and conductor bumps and in the conductor bumps themselves over the extended period of time, even if the connection pads become smaller and the conductor bumps are formed of lead-free solder; and that has superior mechanical and electrical connection reliability with respect to an external electrical circuit board. SOLUTION: The wiring board 9 comprises an insulation substrate 1 made by stacking a plurality of insulation layers; a wiring conductor 2 formed inside the insulation substrate 1; a plurality of cutouts 1a formed on the side face of the insulation substrate 1; a side-face conductor 7 attached to the internal surface of the cutouts 1a; a plurality of connection pads 3 that are so arranged and formed in the periphery of the bottom surface of the insulation substrate 1 as to be extended into the cutouts 1a; blind holes 5 that are so formed in the bottom surface of the insulation substrate 1 as to step over the edge of each connection pad 3; and a conductor layer 6 formed on the internal side face of the holes 5. COPYRIGHT: (C)2006,JPO&NCIPI
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