发明名称
摘要 <p>A method for fabricating a cladded conductor ( 42 ) for use in a magnetoelectronics device is provided. The method includes providing a substrate ( 10 ) and forming a conductive barrier layer ( 12 ) overlying the substrate ( 10 ). A dielectric layer ( 16 ) is formed overlying the conductive barrier layer ( 12 ) and a conducting line ( 20 ) is formed within a portion of the dielectric layer ( 16 ). The dielectric layer ( 16 ) is removed and a flux concentrator ( 30 ) is formed overlying the conducting line ( 20 ).</p>
申请公布号 JP2006508544(A) 申请公布日期 2006.03.09
申请号 JP20040557207 申请日期 2003.11.14
申请人 发明人
分类号 H01L27/105;G01R33/09;G11C11/15;H01F41/04;H01L21/02;H01L21/822;H01L21/8246;H01L27/04;H01L27/22;H01L43/08;H01L43/12 主分类号 H01L27/105
代理机构 代理人
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