| 摘要 |
A semiconductor device according to one embodiment includes a substrate (11), a semiconductor chip (14) arranged on the substrate (11), a first electrode (13) formed in the substrate (11) and connected to the semiconductor chip (14), a concave portion (16) provided on a side of the substrate (11), the concave portion (16) being formed to a depth not to reach a top of the substrate (11) from a back of the substrate (11), and at least part of the first electrode (13) being exposed to the concave portion (16), and a metal layer (17) formed on the at least part of the first electrode (13). |
