发明名称 Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same
摘要 A process of making a multi-layer thermal interface material is depicted. The multi-layer thermal interface material is attached between an in integrated heat spreader and a die. Processing of the multi-layer thermal interface material includes stamping or other pressure processing.
申请公布号 GB2417828(A) 申请公布日期 2006.03.08
申请号 GB20050020460 申请日期 2004.06.03
申请人 INTEL CORPORATION 发明人 SABINA HOULE;ASHAY DANI
分类号 H01L23/373;B23K1/00;B23K35/14;H01L23/433 主分类号 H01L23/373
代理机构 代理人
主权项
地址