A LEAD FRAME AND THE METHOD FOR MANUFACTURING THE SAME
摘要
Provided is a lead frame having an improved wire bonding property of inner leads and an improved soldering property of outer leads and preventing defects with high producing yield, and a method of manufacturing the lead frame. The lead frame includes a plurality of inner leads formed with predetermined intervals between them; and a plurality of outer leads extended from the inner leads in length directions of the inner leads, each of which has an end portion overlapped with the inner lead and coupled thereto and the other end connected to neighboring outer lead by a supporting portion.
申请公布号
KR20060021744(A)
申请公布日期
2006.03.08
申请号
KR20040070614
申请日期
2004.09.04
申请人
SAMSUNG TECHWIN CO., LTD.
发明人
LEE, SOO BONG;KIM, JOONG DO;CHOI, WOO SUK;KIM, EUN HEE