LEAD FRAME

摘要

In soldering outer leads of a semiconductor package, solder sputtered around tie bars exposed in air can lead to device failure by wrong connection. To restrict the problem, a lead frame supported by different tie bars is suggested. Generally the structure of a lead frame (25) generally consists of a die pad (26), at least two tie bars (27), and leads (28) formed at regular intervals around the pad, while in the lead frame suggested here two tie bars are designed to have different areas as shown in the figure or to locate at crossed places.