| 摘要 |
PROBLEM TO BE SOLVED: To inspect a wiring pattern layer before being transferred by forming the wiring pattern layer sequentially comprising an adhesive layer, an insulation layer, and a conductive layer through integral transfer. SOLUTION: A wiring pattern layer 4 sequentially comprises an adhesive layer 10, an insulation layer 20, and conductive layers 31, 33. In a multilayer printed wiring board 9, a wiring pattern 4 is transferred at first onto a substrate 2, a wiring pattern layer 5 is then transferred perpendicularly, and a wiring pattern 6 is transferred to the wiring pattern layer 5 perpendicularly. Each of the wiring pattern layers 4-6 is provided with the insulation layer 20 and mutual insulation is ensured. Furthermore, the pattern layers 4-6 are provided with the conductive layers 31-33 which can be interconnected at the intersection of respective pattern layers or the vicinity. This structure increases the yield of production. |
