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发明名称
LEAD FRAME, SEMICONDUCTOR PACKAGE WITH THE SAME AND MANUFACTURING METHOD THEREOF
摘要
申请公布号
KR20060021743(A)
申请公布日期
2006.03.08
申请号
KR20040070613
申请日期
2004.09.04
申请人
SAMSUNG TECHWIN CO., LTD.
发明人
PARK, KWANG SEOK;KIM, JOONG DO;KIM, YONG NAM
分类号
H01L23/495
主分类号
H01L23/495
代理机构
代理人
主权项
地址
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