发明名称 |
Circuit module for memory expansion |
摘要 |
A circuit module 10 comprises a rigid substrate 14 having laterally opposed sides S1, S2 and a flexible circuit 12 wrapped around one edge 16A of the substrate. The flexible circuit is attached to at least one of the sides of the substrate and has a plurality of contacts 20 in the vicinity of the edge 16A for connection to a circuit board socket. A plurality of memory CSPs 18 (chipscale packaged devices) are provided on at least one of the sides of the flexible circuit. Also claimed are modules having thermally conductive properties and various shaped substrates. |
申请公布号 |
GB2417836(A) |
申请公布日期 |
2006.03.08 |
申请号 |
GB20050016622 |
申请日期 |
2005.08.12 |
申请人 |
STAKTEK GROUP L.P. |
发明人 |
PAUL GOODWIN;JAMES W CADY;JAMES DOUGLAS WEHRLY |
分类号 |
H05K1/14;G11C5/00;H01L25/10;H05K1/02;H05K1/11;H05K1/18 |
主分类号 |
H05K1/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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