Conductor paste, method of printing the conductor paste and method of fabricating ceramic circuit board

摘要

A Low Temperature Co-fired Ceramic circuit board is fabricated using conductor paste and ceramic green sheet whose shrinkage factors are in the ratio 0.26 to 0.73 inclusive, when the temperature is increased from a shrinkage starting temperature to 900{C. The conductor paste may be a Silver (Ag) conductor paste including 0.005 to 0.050 % Rhodium (Rh) by weight. The green sheet may comprise a mixture of alumina and CaO-SiO2-Al2O3-B2O3 glass.