Rectification chip terminal structure

摘要

A rectification chip terminal structure for soldering a rectification chip encased in a glass passivated pallet (GPP) on a terminal filled with a packaging material to form a secured mounting for the rectification chip is to be inserted in a coupling bore of a circuit board. The structure includes a conductive element which has a buffer portion and a base seat to prevent the GPP from fracturing when the packaging material is heated and expanded or prevent the conductive element from bending and deforming under external forces, and has a stress buffer zone to prevent the chip from being damaged and moisture from entering. It can prevent the GPP from fracturing when the packaging material is heated and expanded and be installed easily in the coupling bore of the circuit board and hold the packaging material securely without breaking away.