| 摘要 |
An improved semiconductor die stacking scheme is provided. In accordance with one embodiment of the present invention, a method of stacking a plurality of semiconductor die is provided. In accordance with another embodiment of the present invention a multiple die semiconductor assembly is provided. Each embodiment relates generally to a stacked semiconductor die assembly including a substrate, first and second semiconductor dice including stacking surfaces and active surfaces, a decoupling capacitor, and one or more conductive lines connecting elements of the assembly.
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