发明名称 |
Semiconductor device |
摘要 |
A semiconductor device includes a semiconductor chip having a main surface provided with an integrated circuit including a photoelectric converter and a first wiring for electrically connecting the integrated circuit of the semiconductor chip to respective external terminals. The semiconductor device also includes a sealing resin for sealing the main surface of the semiconductor chip and the first wiring, formed so as to have an opening over the surface of the integrated circuit and a light-transmitting cap for covering the opening of the sealing resin.
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申请公布号 |
US7009295(B2) |
申请公布日期 |
2006.03.07 |
申请号 |
US20030722520 |
申请日期 |
2003.11.28 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
NOGUCHI TAKASHI |
分类号 |
H01L23/48;H01L27/14;H01L23/02;H01L23/52;H01L27/146;H01L31/0203;H01L31/0232;H04N5/335;H04N5/372 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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