发明名称 |
Lead-frame-based semiconductor package and fabrication method thereof |
摘要 |
A lead-frame-based semiconductor package and a fabrication method thereof are proposed. The semiconductor package includes: a lead frame having a plurality of first and second leads, wherein each first lead is formed with an extending portion smaller in thickness than the first lead in a manner that, an upper surface of the extending portion is flush with an upper surface of the first lead, and a lower surface of the extending portion forms a height difference with respect to a lower surface of the first lead; a chip mounted over the upper surfaces of the extending portions, and electrically connected to the leads by bonding wires; an encapsulant for encapsulating the upper surfaces of leads, upper surfaces of extending portions, chip and bonding wires; and a non-conductive material applied over the lower surfaces of extending portions, wherein the lower surfaces of leads are exposed to outside of the non-conductive material.
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申请公布号 |
US7008826(B2) |
申请公布日期 |
2006.03.07 |
申请号 |
US20040938144 |
申请日期 |
2004.09.10 |
申请人 |
SILICONWARE PRECISION INDUSTRIES, CO., LTD. |
发明人 |
CHEN HOLMAN;HUANG CHIEN-PING;HONG CHIN-YUAN;HUNG JUI-HSIANG;HSU CHIN-TENG |
分类号 |
H01L21/50;H01L21/48;H01L23/31;H01L23/495 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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