发明名称 Substrate manufacturing method
摘要 This invention provides a method of manufacturing a substrate having a thin buried insulating film. An insulating layer ( 12 ) is formed on a single-crystal Si substrate ( 11 ). Ions are implanted into the substrate ( 11 ) through the insulating layer ( 12 ) to form an ion-implanted layer ( 13 ). The insulating layer ( 12 ) is thinned down to form a thin insulating layer ( 12 a). A thus prepared first substrate is placed on a second substrate ( 20 ) to form a bonded substrate stack ( 30 ). After that, the bonded substrate stack ( 30 ) is split at the ion-implanted layer ( 13 ).
申请公布号 US7008860(B2) 申请公布日期 2006.03.07
申请号 US20040778248 申请日期 2004.02.17
申请人 CANON KABUSHIKI KAISHA 发明人 KAKIZAKI YASUO;ITO MASATAKA
分类号 H01L21/30;H01L21/02;H01L21/762;H01L27/12 主分类号 H01L21/30
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