发明名称 |
Substrate manufacturing method |
摘要 |
This invention provides a method of manufacturing a substrate having a thin buried insulating film. An insulating layer ( 12 ) is formed on a single-crystal Si substrate ( 11 ). Ions are implanted into the substrate ( 11 ) through the insulating layer ( 12 ) to form an ion-implanted layer ( 13 ). The insulating layer ( 12 ) is thinned down to form a thin insulating layer ( 12 a). A thus prepared first substrate is placed on a second substrate ( 20 ) to form a bonded substrate stack ( 30 ). After that, the bonded substrate stack ( 30 ) is split at the ion-implanted layer ( 13 ).
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申请公布号 |
US7008860(B2) |
申请公布日期 |
2006.03.07 |
申请号 |
US20040778248 |
申请日期 |
2004.02.17 |
申请人 |
CANON KABUSHIKI KAISHA |
发明人 |
KAKIZAKI YASUO;ITO MASATAKA |
分类号 |
H01L21/30;H01L21/02;H01L21/762;H01L27/12 |
主分类号 |
H01L21/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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