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发明名称
LEADFRAME LOADING ASSEMBLY OF APPARATUS FOR PLATING LEADFRAME
摘要
申请公布号
KR20060021040(A)
申请公布日期
2006.03.07
申请号
KR20040069846
申请日期
2004.09.02
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
HAN, SANG HUN;LEE, DO WOO;LEE, BYEONG CHUN;UM, TEA SEOG;PARK, KYUNG SOO
分类号
H01L21/60
主分类号
H01L21/60
代理机构
代理人
主权项
地址
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