发明名称 Polyamide composition
摘要 Provided is a polyamide composition comprising 100 parts by weight of (A) a polyamide having dicarboxylic acid units containing 60 to 100 mol % of terephthalic acid units, and diamine units containing 60 to 100 mol % of 1,9-nonanediamine units and/or 2-methyl-1,8-octanediamine units, and 5 to 100 parts by weight of (B) a titanium oxide with an average particle size of 0.1 to 0.5 mum. The polyamide composition shows excellent heat resistance enough to withstand the SMT process, and gives a molded article with excellent whiteness and surface-reflectance.
申请公布号 US7009029(B2) 申请公布日期 2006.03.07
申请号 US20030464474 申请日期 2003.06.19
申请人 KURARAY CO., LTD. 发明人 OKA HIDEAKI;MATSUOKA HIDEHARU;KUKI TORU
分类号 C08G69/26;C08L77/00;C08K3/22 主分类号 C08G69/26
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