发明名称 Method and apparatus for joining substrates
摘要 In order to reduce cycle times for assembling at least two substrates ( 3,4 ) in order to form an optical data carrier in a low-pressure chamber ( 8 ), a method and a device are disclosed wherein an opening ( 11 ) of the low-pressure chamber is sealed in relation to the surrounding environment, the low-pressure chamber is pumped out, a transfer chamber ( 64 ) is formed between a first handling device ( 16 ) arranged in the low-pressure chamber and a second handling device ( 24 ) arranged outside the low-pressure chamber by respectively sealing the opening ( 11 ) of the low-pressure chamber ( 8 ). The transfer chamber ( 64 ) has a smaller volume than that of the low-pressure chamber ( 8 ); the substrates ( 3, 4 ) in the transfer chamber ( 64 ) are transferred from the second handling device ( 24 ) to the first handling device ( 16 ); the substrates are conveyed ( 3, 4 ) with the first handling device ( 16 ) to an assembly station ( 14 ) in the low-pressure chamber when low-pressure chamber is sealed by the second handling device ( 24 ), and the substrates ( 3,4 ) are assembled in the assembly station ( 14 ).
申请公布号 US7008502(B2) 申请公布日期 2006.03.07
申请号 US20030250793 申请日期 2003.07.08
申请人 STEAG HAMATECH AG 发明人 SPEER ULRICH;WAGNER ROLAND;LEONHARDT STEPHAN
分类号 G11B7/26;B29C65/00;B29C65/48 主分类号 G11B7/26
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