发明名称 |
Glass frit bond and process therefor |
摘要 |
A lead-containing glass material of the type suitable for use in a wafer bonding process, wherein the moisture resistance of the glass material is increased by the presence of a lead phosphate coating on an outer exposed surface of the material, thereby acting as a barrier to reaction of moisture with the lead of the glass material. A source of reactive phosphate ions is applied to the glass material so as to spontaneously form the desired lead phosphate coating.
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申请公布号 |
US7008855(B2) |
申请公布日期 |
2006.03.07 |
申请号 |
US20040955363 |
申请日期 |
2004.09.30 |
申请人 |
DELPHI TECHNOLOGIES, INC. |
发明人 |
BANEY WILLIAM J.;BANEY BRENDA B.;HUDE HEATHER |
分类号 |
H01L21/46;C03C8/08;C03C8/10;C03C17/02;C03C17/04;C04B37/02 |
主分类号 |
H01L21/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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