| 摘要 |
An optical semiconductor device (A1) includes an optical reflector (5) and an optical semiconductor chip (3). The optical reflector (5) includes two first reflection surfaces (50a) separated in the x-direction and two second reflection surfaces (50b) separated in the y-direction. The chip (3) includes rectangular upper and lower surfaces separated in the z-direction orthogonal to x- and y- directions. Further, the chip (3) includes at least one light emission side surface (31) extending between the upper and lower surfaces. The light emission side surface (31) is opposed to a corresponding one second reflection surface (50b). Further, this light emission side surface (31), when seen parallel to the z-direction, is non-parallel to the second reflection surface (50b).
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