| 摘要 |
Abstract of the Disclosure Integrated circuits (ICs) are stacked into modules that conserve PCB or other board surface area. The modules provide for lower capacitance memory signaling systems and methods for connecting stacked CSPs in a serial cascade arrangement. In one preferred embodiment, on-die terminations are used selectively to terminate a cascaded series of conductive paths. In another preferred embodiment, a form standard provides a physical form that allows many of the varying package sizes found in a broad family of CSP packages to be used to advantage while employing a standard connective flex circuitry design.
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