Substrate, semiconductor device, substrate fabricating method, and semiconductor device fabricating method

摘要

A semiconductor element having a first external connection terminal is connected to a substrate. The substrate includes a base material and a wiring portion, positioned at the first surface side of the base material. This configuration facilitates the realization of the connection between the first external connection terminal and the wiring portion. The wiring portion is positioned coplanar to the first surface of the base material. The substrate also includes a via portion that is integrally formed with the wiring portion and is arranged to penetrate the base material.