发明名称 |
PACKAGING OF INTEGRATED CIRCUITS TO LEAD FRAMES |
摘要 |
A lead frame (200) for housing an integrated circuit is disclosed comprising a main member (220) and an engagement portion (230) for receiving an integrated circuit (210). The integrated circuit (210) is located at the engagement portion (230) and engaged with the lead frame through resilient engagement with the first and second engagement members (222, 223). The first and second engagement members (222, 223) which depend from the main member, secure the integrated to the lead frame by engaging in resilient contact respective opposed surfaces of the integrated circuit. The integrated circuit is engaged to the lead frame by clipping into it into position between the engagement members. There is no need for a gluing process unlike conventional lead frame designs which where the integrated circuit is attached to a lead frame by gluing it onto the die paddle. |
申请公布号 |
WO2006022591(A1) |
申请公布日期 |
2006.03.02 |
申请号 |
WO2004SG00259 |
申请日期 |
2004.08.26 |
申请人 |
INFINEON TECHNOLOGIES AG;YIP, TIAN SIANG;KEE, BEE NGOH |
发明人 |
YIP, TIAN SIANG;KEE, BEE NGOH |
分类号 |
(IPC1-7):H01L23/495;H01L21/48 |
主分类号 |
(IPC1-7):H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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