Image sensor module, has lens retainer with sidewall and internal thread, where sidewall is affixed to top surface of substrate through glue layer provided on frame layer of substrate so as to include chip

摘要

The module has a substrate (40) whose top surface and bottom surface are provided with an electrode. A chip (42) with a sensor range and several bond sports is assembled on the top surface. A lens retainer (48) is provided with a sidewall and an internal thread. The sidewall is affixed to the top surface of the substrate through a glue layer (46) provided on a frame layer of the substrate so as to include the chip.