发明名称 |
Polierverfahren und Vorrichtung |
摘要 |
A polishing apparatus can improve the uniformity of thickness within a workpiece or reduce thickness variation between serially polished workpieces. The polishing apparatus comprises a polishing unit having a polishing tool for providing a polishing surface and a workpiece holding device for holding the workpiece. A polishing solution supplying device is provided for supplying a polishing solution into a polishing interface between the surface of the workpiece and the polishing surface. A temperature of the polishing interface is controlled according to at least an ambient temperature of a polishing space surrounding the polishing unit, as a variable parameter. <IMAGE> |
申请公布号 |
DE69829919(T2) |
申请公布日期 |
2006.03.02 |
申请号 |
DE1998629919T |
申请日期 |
1998.07.30 |
申请人 |
EBARA CORP., TOKIO/TOKYO |
发明人 |
KAWAMOTO, TAKAYOSHI;KIMURA, NORIO;YASUDA, HOZUMI;YOSHIDA, HIROSHI |
分类号 |
B24B37/00;B24B37/013;B24B37/015;B24B37/04;B24B49/14;H01L21/304 |
主分类号 |
B24B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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