A semiconductor device, which may include a heat sink using a thermal induced adhesive is provided. The adhesive strength of the thermal induced adhesive at room temperature may be reduced when heated. The thermal induced adhesive may attach the heat sink to the semiconductor device, and may result in a thinner semiconductor device.
申请公布号
KR20060018453(A)
申请公布日期
2006.03.02
申请号
KR20040066819
申请日期
2004.08.24
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
BANG, HYO JAE;KIM, BYUNG MAN;LEE, DONG CHUN;YU, KWANG SU