| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a liquid epoxy resin composition exhibiting a flow property having low shear rate dependence (low thixotropy), curable at a low temperature, enabling easy repairing of even an electronic component device having defective electric connection after underfilling by removing a residue, consisting of a low-viscosity one-pack solvent-free composition having a long pot life and giving a highly reliable connected electronic component device having a mounted structure. <P>SOLUTION: The liquid epoxy resin composition is usable for the resin sealing of a gap between a circuit board and a semiconductor element of an electronic component device having the semiconductor element mounted on the circuit board in a state placing the connection electrodes of the semiconductor element opposite to the connection electrodes of the circuit board. The liquid epoxy resin composition contains (A) a liquid epoxy resin, (B) a liquid phenolic resin, (C) a solid-dispersed amine adduct cure accelerator powder, (D) an amine-based silane coupling agent and (E) an inorganic filler. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
