发明名称 RESIN COMPOSITION, AND SHEET, PREPREG-LIKE MATERIAL, METALLIC FOIL-CLAD SHEET, LAMINATED BOARD, ELECTRICAL INSULATION MATERIAL AND RESIST MATERIAL EACH USING THE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a resin composition with high heat resistance and high dielectric constant and low dielectric loss tangent in high-frequency region, and to provide sheets, prepreg-like materials, metallic foil-clad sheets, laminated boards, electrical insulation materials and resist materials each using the resin composition. SOLUTION: The resin composition comprises a polyester, an epoxy resin, a curing promoter and dielectric powder, wherein the polyester is composed of an aromatic polycaroxylic acid residue having an aryloxycarbonyl group or arylcarbonyloxy group on the molecular chain end and an aromatic polyhydroxy compound residue. This resin composition has a dielectric constant of at least 4 and a Q-value of at least 250. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006056981(A) 申请公布日期 2006.03.02
申请号 JP20040239888 申请日期 2004.08.19
申请人 TDK CORP 发明人 TAKATANI MINORU;KAWABATA KENICHI;MORITA TAKAAKI
分类号 C08G59/40;B32B15/09;C08J5/24;C08K3/22;C08K5/03;C08L9/00;C08L25/00;C08L63/00;C08L67/03;H05K1/03 主分类号 C08G59/40
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