| 摘要 |
PROBLEM TO BE SOLVED: To reinforce peeling strength of a metal layer for forming a wiring film on an interlayer insulating film with respect to the interlayer insulating film or of the wiring film by reducing the number of press processes required for the manufacture of a wiring board to raise manufacturing efficiency and hence improve productivity. SOLUTION: An embedding metal layer 12 is stacked with a press on the surface of a metal plate 6 for forming a wiring film, on one surface of which a metal bump 4 for interlayer connection is formed via an interlayer insulating film 10, and the surfaces of the metal layer 12 for embedding and the interlayer insulating film 10 are polished until the top surface 4a of the metal bump 4 is exposed to form the embedded metal layer 12a on the surface of the interlayer insulating film 10. Further, the metal layer 16 for forming a wiring film at least having a portion connected to the top surface 12a of the metal bump 12 is formed with plating on the surface of the interlayer insulating film 10c. COPYRIGHT: (C)2006,JPO&NCIPI
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