发明名称 |
Solder composition, connecting process with soldering, and connection structure with soldering |
摘要 |
There is provided a solder composition which contains: (1) a metal material comprising solder particles, and (2) a thermosetting flux material comprising a thermosetting resin and a solid resin which changes to be in its liquid-like state when heated with a proviso that the thermosetting resin is excluded from the solid resin, wherein a temperature at which the solid resin changes to be in the liquid-like state is lower than a temperature at which the thermosetting resin starts to cure.
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申请公布号 |
US2006043543(A1) |
申请公布日期 |
2006.03.02 |
申请号 |
US20050209621 |
申请日期 |
2005.08.24 |
申请人 |
WADA YOSHIYUKI;SAKAI TADAHIKO;YOSHINAGA SEIICHI |
发明人 |
WADA YOSHIYUKI;SAKAI TADAHIKO;YOSHINAGA SEIICHI |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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