Cushion for packing disks such as semiconductor wafers

摘要

A cushion device ( 40 ) for packing disks ( 22 ) such as semiconductor wafers has a base ( 42 ) that is selectively secured within a container ( 20 ). The cushion ( 40 ) includes a plurality of cushion members ( 60 ) each having two ends supported by the base ( 42 ). In a disclosed example, the cushion members ( 60 ) have a stepped configuration between the two ends. Angles between adjacent generally linear portions of the stepped configuration change as the cushion members flex responsive to engaging a semiconductor wafer within the container. A disclosed example includes a contacting portion ( 90 ) near a vertex ( 92 ) between two adjacent linear portions of a cushion member ( 60 ). One example has contacting portions ( 90 ) of aligned cushion members spaced at an angle between about 65° and about 180°.