发明名称 |
Visually inspectable surface mount device pad |
摘要 |
A printed circuit board having one or more vias disposed in the surface area of a pad. The pad may serve as a connection point between the printed circuit board and another circuit board and is disposed along the edge of the board such that the vias do not form half vias.
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申请公布号 |
US2006042831(A1) |
申请公布日期 |
2006.03.02 |
申请号 |
US20050216813 |
申请日期 |
2005.08.31 |
申请人 |
SYNERGY MICROWAVE CORPORATION |
发明人 |
ROHDE META;SCHOEPF KLAUS J.;PODDAR AJAY K.;REBEL REIMUND |
分类号 |
H05K1/11;H05K1/09 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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