INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To enable a semiconductor integrated circuit device having semiconductor integrated circuit elements with high electrode arrangement density to connect to a printed wiring board having lower density than the electrode arrangement density.

SOLUTION: The semiconductor integrated circuit device comprises a monolithic integrated circuit element 4, and a wiring board 6 having an electrode wiring layer 42 for making an external electrode. The plane positional relationship at each of the electrodes 28 of the semiconductor integrated circuit element 4 is made different mutually from the plane positional relationship at the electrode wiring layers of the wiring board 6. Each electrode 28 and an electrode corresponding to each electrode 44 of the wiring board are mutually and electrically connected via each wiring layer of the wiring board 6 at least and metal bumps 32 and 38.

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