| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate and a semiconductor device capable of improving adhesive properties between a semiconductor element and the substrate while being capable of reducing a manufacturing cost regarding the substrate and the semiconductor device with penetrating sections for passing bonding wires connected to external connecting terminals for the semiconductor element. SOLUTION: A pair of dams 62 are formed near the penetrating sections 53 of the surfaces 52B of base materials 52 on the side, on which the semiconductor element 65 on the substrate 51 is bonded so as to hold the penetrating sections 53. The substrate 51 and the semiconductor element 65 are bonded with a pasty adhesive 69 so that a pair of the dams 62 and the semiconductor element 66 are brought into contact. COPYRIGHT: (C)2006,JPO&NCIPI |
