发明名称 JET PLATING DEVICE
摘要 PROBLEM TO BE SOLVED: To attain the minimization of an exchanging member of a cathode electrode body required per change in the kind of the object to be plated and the simplification of the exchanging operation by improving the cathode electrode body and the mechanism of the peripheral part thereof. SOLUTION: In the jet plating device where the conductor part of a substrate 1 as the object to be plated is arranged downward on the opening side of a jet plating tank 10 for generating the jet of a plating liquid, and electric current is made to flow between a cathode electrode body 30 and an anode electrode 5 connected to the conductor part while jetting the plating liquid on the conductor part, so as to perform plating, the cathode electrode body 30 is divided into a fixed cathode electrode part 31 and a power feed electrode part 40. The fixed cathode electrode part 31 is supported by a cathode fixing support part 15, and the power feed electrode part 40 is supported by an elevation power feed part 45 so as to be freely elevated/lowered. At least the part contacted with the conductor part of the substrate 1 in the fixed cathode electrode part 31 is freely exchangeable, and, when the elevation power feed part 45 is lowered, the power feed electrode part 40 is contacted with the fixed cathode electrode part 31 and feeds power thereto. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006057113(A) 申请公布日期 2006.03.02
申请号 JP20040236959 申请日期 2004.08.17
申请人 TDK CORP 发明人 KUDO JUN;YAMAMOTO HIROSHI;AIBA TAKASHI;NAKAYAMA SHOICHI;TODA KAZUSHIGE;UMETSU AKIHIKO
分类号 C25D17/00;C25D5/08 主分类号 C25D17/00
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