| 摘要 |
PROBLEM TO BE SOLVED: To simply manufacture a semiconductor element having a curved mirror with a cost advantage. SOLUTION: In a semiconductor component equipped with a semiconductor having the curved mirror integrated into the semiconductor monolithically, a semiconductor layer on a thinned stress fixing layer made of metal or an alloy is pressed via the stress fixing layer, thus giving compressive or tensile stress to the semiconductor layer for forming the curved semiconductor mirror. COPYRIGHT: (C)2006,JPO&NCIPI
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