Method of mounting and demounting a semiconductor device, device for mounting and demounting a semiconductor device using the same, and socket for a semiconductor device

摘要

A cover member 34 is moved upward when a semiconductor device 26 disposed in a positioning member 44 is held by an absorption pad 24 to pinch an electrode portion 26 a of the semiconductor device 26 with movable contact portions 46 M and 46 F of a contact terminal 46 ai.