| 摘要 |
A method wherein a substrate with plating tails is formed or otherwise provided, such as by performing a conventional electroplating process. Subsequently, a laser is used to remove some or all of the plating tails or a portion of some or all of the plating tails. If portions or remnants of the plating tails are to remain, the plating tails can be connected to ground. By connecting the remnants of the plating tails to ground, an electrical performance enhancement can be realized. Specifically, additional shielding in the package can be provided. Furthermore, the plating tails can be specifically designed to enhance the amount of shielding they provide.
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