摘要 |
<p>A method for producing a porous resin substrate having a hole bored therethrough, which comprises a step (1) of boring at least one hole passing through a porous resin substrate formed form a resin material containing a fluorine-containing polymer in the thickness direction, a step (2) of contacting the surface of the inner wall with an etching solution containing an alkali metal, to subject the surface to an etching treatment, and a step (3) of contacting a modified layer formed by the etching treatment with a compound having oxidizing power or a solution thereof, to thereby remove said modified layer; the method for producing a porous resin substrate which further comprises imparting electroconductivity to the surface of the inner wall of said hole bored therethrough.</p> |
申请人 |
IDOMOTO, YUICHI;SUMITOMO ELECTRIC INDUSTRIES, LTD.;UENOYAMA, MAYO;OKUDA, YASUHIRO;HAYASHI, FUMIHIRO;FUJITA, TARO;MASUDA, YASUHITO |
发明人 |
UENOYAMA, MAYO;OKUDA, YASUHIRO;HAYASHI, FUMIHIRO;FUJITA, TARO;MASUDA, YASUHITO;IDOMOTO, YUICHI |