发明名称 METHOD FOR PRODUCING POROUS RESIN SUBSTRATE HAVING HOLE BORED THERETHROUGH AND POROUS RESIN SUBSTRATE PROVIDED WITH HOLE HAVING INNER WALL SURFACE IMPARTED WITH ELECTROCONDUCTIVITY
摘要 <p>A method for producing a porous resin substrate having a hole bored therethrough, which comprises a step (1) of boring at least one hole passing through a porous resin substrate formed form a resin material containing a fluorine-containing polymer in the thickness direction, a step (2) of contacting the surface of the inner wall with an etching solution containing an alkali metal, to subject the surface to an etching treatment, and a step (3) of contacting a modified layer formed by the etching treatment with a compound having oxidizing power or a solution thereof, to thereby remove said modified layer; the method for producing a porous resin substrate which further comprises imparting electroconductivity to the surface of the inner wall of said hole bored therethrough.</p>
申请公布号 WO2006022083(A1) 申请公布日期 2006.03.02
申请号 WO2005JP12768 申请日期 2005.07.11
申请人 IDOMOTO, YUICHI;SUMITOMO ELECTRIC INDUSTRIES, LTD.;UENOYAMA, MAYO;OKUDA, YASUHIRO;HAYASHI, FUMIHIRO;FUJITA, TARO;MASUDA, YASUHITO 发明人 UENOYAMA, MAYO;OKUDA, YASUHIRO;HAYASHI, FUMIHIRO;FUJITA, TARO;MASUDA, YASUHITO;IDOMOTO, YUICHI
分类号 (IPC1-7):H05K3/42;H05K3/26;H05K3/00 主分类号 (IPC1-7):H05K3/42
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