| 摘要 |
PROBLEM TO BE SOLVED: To reduce a fear that a vapor deposition material evaporated in an evaporation source sticks to a shielding plate or a jetting plate when it passes through the shielding plate and the jetting plate. SOLUTION: In the vapor deposition system where a substrate (22) is arranged at the position confronted with an evaporation source 15, and a vapor deposition material is vapor-deposited on the substrate (22), a shielding plate 14 having a plurality of holes 14<SB>1</SB>and a jetting plate 13 having a plurality of holes 13<SB>1</SB>are arranged between the evaporation source 15 and the substrate (22), and a heating mechanism 17 for heating the evaporation source 15 and a heating mechanism 16 for heating the shielding plate 14 and the jetting plate 13 are separately positioned. COPYRIGHT: (C)2006,JPO&NCIPI
|
