| 摘要 |
A structure and a process of semiconductor package with an exposed heatsink not only reduces the mold-clamping force acted on the chip but also improves the heat-dissipation by the heatsink directly adhered on the chip. Furthermore, the reliability of the semiconductor package is also improved. The structure of semiconductor package comprises a substrate, a chip disposed on the substrate, a heatsink with a bottom surface adhered to the top surface of the chip, and an encapsulation material over the substrate, the chip and part of the lateral side of the heatsink, wherein the top end of the lateral side of the heatsink is higher than the encapsulation material at least 0.05 mm.
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