发明名称 |
Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices |
摘要 |
Microelectronic imaging devices and methods of packaging microelectronic imaging devices are disclosed herein. In one embodiment, a microelectronic imaging device includes a microelectronic die having an integrated circuit, an image sensor electrically coupled to the integrated circuit, and a plurality of bond-pads electrically coupled to the integrated circuit. The imaging device further includes a cover over the image sensor and a plurality of interconnects in and/or on the cover that are electrically coupled to corresponding bond-pads of the die. The interconnects provide external electrical contacts for the bond-pads of the die. The interconnects can extend through the cover or along a surface of the cover.
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申请公布号 |
US2006043509(A1) |
申请公布日期 |
2006.03.02 |
申请号 |
US20040925502 |
申请日期 |
2004.08.24 |
申请人 |
WATKINS CHARLES M;HEMBREE DAVID R;BENSON PETER A;AKRAM SALMAN |
发明人 |
WATKINS CHARLES M.;HEMBREE DAVID R.;BENSON PETER A.;AKRAM SALMAN |
分类号 |
H01L21/00;H01L27/14;H01L31/0232 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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