Verfahren zur Kontaktierung eines Hochleistungsdiodenlaserbarrens und eine Hochleistungsdiodenlaserbarren-Kontakt-Anordnung

摘要

The contact (2) and high power diode laser block are joined using a joining material (3a) containing an adhesive (3b). The adhesive may be non-metallic. The joining material may also include electrically conductive material. The joining material obtains its functional properties after a curing process for the adhesive. Independent claims are included for a high power diode laser, a high power diode laser block contact device, and a high power diode laser stack.