| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board manufacturing method which enables the formation of a conductive film pattern of higher productivity. <P>SOLUTION: Prior to the formation of the conductive film pattern 4a, a conductive post 30 is formed on a reception layer 2 formed on a board 1. Being designed to show sufficient performance in response to the linear discharge of a liquid material 22 containing conductive corpuscles, the reception layer 2 has sufficient capacity to receive a solvent (dispersion medium) delivered by point discharge in forming the conductive post 30. Because of this, the conductive post 30 can be readily formed without an interposing drying process. The conductive post 30 and the conductive pattern 4a, therefore, can be formed almost simultaneously. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
