| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic device sealed with a low-viscosity one-pack solvent-free epoxy resin composition exhibiting a flow property having low shear rate dependence (low thixotropy), curable at a low temperature and having a long pot life. <P>SOLUTION: The electronic device has a semiconductor device 1 mounted on a printed circuit board 2 in a state placing the connection electrodes (solder bumps) 3 of the semiconductor device 1 opposite to the connection electrodes (solder pads) 5 of the printed circuit board 2. The gap between the printed circuit board 2 and the semiconductor device 1 is sealed by a sealing resin layer 4 composed of a liquid epoxy resin composition containing (A) a liquid epoxy resin, (B) a liquid phenolic resin, (C) a solid-dispersed amine adduct cure accelerator powder, (D) an amine-based silane coupling agent and (E) an inorganic filler. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
